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Epoxy resin technical specifications
2021-10-19

环氧树脂技术规格 维连电子

Epoxy resin technical specifications

Epoxy resin is used to install and fix the sensor, while providing heat contact and electrical insulation with samples. Epoxy resin can also be used for mechanical connections and joints. StyCast® 2850FT is a black epoxy resin with a thermal expansion coefficient that matches copper. The low -temperature conductive epoxy resin of filling the silver has excellent strength, conductivity and thermal conductivity.

Low -temperature conductive epoxy resin
This epoxy resin is used to permanently connect the test sample or temperature sensor to the sample rack. It is a 100% solid, dual -component, low -temperature curing, silver filling epoxy resin, with very high conductivity and thermal conductivity, and has excellent strength and adhesive performance.

Characteristic
● Excellent low temperature guidance and conductivity
● Low viscosity
● Tentile degeneration
● No resin exudation during the curing process
● Low body weight loss
● Low volatility

Note: Epoxy resin must be cured at least 50 ° C for 12 hours to achieve appropriate electrical and physical properties. The best performance will be achieved at 175 ° C for 45 seconds.
ESF-2-5 and ESF-2-10 can be used for 300 MK and below. The result may vary depending on the materials used.

Epoxy resin specification

  Low -temperature conductive epoxy resin Stycast ®Epoxy resin
Maximum temperature 573 thousand 403 thousand
Glassification transition temperature ≥353 K 359 thousand
Thermal Conductivity
1 K 0.0065 W/(m·K)
4.2K 0.064 W/(m·K)
300 K 2.5 watt/(Mi · K) 1.3 watt/(Mi · K)
Hot expansion (1/k) >360 K:150 × 10 -6
<360 K:43 × 10 -6
29 × 10 -6
Volume resistivity 298 k:
0.0001 to 0.0004 (ω · cm)
298 K: 5 × 10 14 (Ω·m)
394 K: 1 × 10 10 (Ω·m)
Her quality period (maximum 298 k) 12 months from the date of production at room temperature 12 months from the date of production at room temperature
Applicable period* 4 days, ~ 1 day working time 45 minutes, ~ 20 minutes working time
Treatment schedule 323 K: 12 hours
353 K: 90 minutes
393 K: 15 minutes
423 K: 5 minutes
448 K: 45 seconds
298 k: 16 to 24 hours
318 K: 4 to 6 hours
338 K: 1 to 2 hours
The strength of the dielectric NA (conductive) 14.4 kv/mm
A dielectric constant NA (conductive) (1 Million Hz): 5.01
Steam pressure <13.3 Pa (0.1 Torr) 在 298 K
Remove TML:0.25% CVCM:0.1%

*The applicable period is defined as the time required for the initial mixed viscosity to double or the low viscosity product (<1000 CP). The timing starts at the moment when the product is mixed and measured at room temperature.

The working time is the time that the epoxy resin maintains a sufficiently low viscosity so that it can still be easily applied to parts or substrates in specific applications. Therefore, the working life may vary depending on the application and even the application method of epoxy resin, so there is no unified method to quantify the characteristics. This value should be regarded as an estimated value

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